Electronic Component Engineer

JobDescription:

• Seekingadetail-orientedMid-LevelComponentEngineerforacontractengagementtosupportourhardwaredevelopmentandmanufacturingpipelines.
• Inthisrole,youwillbeprimarilyresponsibleforevaluatingelectronicandmechanicalcomponentspecifications,identifyingcompliancerequirements,anddefiningprecisepackagingandhandling(P&H)instructionstoensurecomponentintegritythroughoutthesupplychain.
• Youmaycollaboratecloselywithprocurement,qualityassurance,engineering,andexternalsupplierstoidentifyrisksrelatedtoelectrostaticdischarge(ESD),moisturesensitivity,andphysicaldamage.

• Responsibilities:
• SpecificationAnalysis:Reviewandanalyzecomponentdatasheets,engineeringdrawings,andtechnicalspecificationstounderstandphysical,electrical,andenvironmentalconstraints.
• Packaging&HandlingDefinition:Determineanddocumentcorrectpackagingmethods(e.g.,tapeandreel,trays,tubes)andhandlinginstructionsbasedonindustrystandardsandmanufacturingrequirements.
• Moisture&ESDManagement:IdentifyMoistureSensitivityLevels(MSL)andElectrostaticDischarge(ESD)classificationstoestablishappropriateprotectivestorageandhandlingprotocols.
• SupplierCollaboration:Potentiallyworkwithlogistics,engineering,componentmanufacturersanddistributorstoresolvetechnicaldiscrepanciesregardingpackagingconfigurationsandshippingstandards.
• Database&DocumentationMaintenance:Updateinternalcomponentdatabases,ProductLifecycleManagement(PLM)systems,andApprovedVendorLists(AVL)withaccuratepackagingandcompliancemetadata.
• RiskMitigation:Identifyobsoletepackagingtypes,ornon-compliantsupplierpracticesandproposeactionablealternativestoengineeringandprocurementteams.

• Requirements:
• TechnicalKnowledge:Deepunderstandingofelectroniccomponentpackagingtypes(SMD,Through-Hole,BGA,QFN)andindustrystandardssuchasIPC/JEDEC(e.g.,J-STD-020,J-STD-033)andANSI/ESDS20.20.
• SoftwareProficiency:Hands-onexperienceusingPLMsoftware(suchasPTCcommonPDM)andcomponentdatabasetools(likeSiliconExpertorIHSMarkit).
• AttentiontoDetail:Provenabilitytometiculouslyinterpretcomplextechnicaldatasheetsandmechanicaldrawings.
• Communication:Clearwrittenandverbalcommunicationskillsneededtocollaborateacrosscross-functionalteams.

• Experience:
• 3to5yearsofexperienceincomponentengineering,hardwaremanufacturing,orqualityengineering.

• Education:
• Bachelor'sdegreeinElectricalEngineering,MechanicalEngineering,MaterialsScience,orarelatedtechnicaldiscipline.

Zobility is RGBSI's workforce management and staffing division. RGBSI is a multi-national corporation headquartered in Troy, MI with branches throughout the USA, Canada, Germany, and India.