AA degree, BSEET, or equivalent experience in Electronics, Electrical Engineering, or a related technical field.
5+ years of experience laying out complex multilayer PCBs for commercial, industrial, or related electronic products.
Advanced proficiency with Altium Designer, Cadence Allegro, or comparable PCB layout platforms.
Strong expertise in multilayer PCB layout, including analog, digital, mixed-signal, high-speed, and power board design.
Hands-on experience applying signal integrity, power integrity, EMI/EMC mitigation, stackup definition, and DFM/DFA methodologies.
Experience creating manufacturing release packages including Gerber files, ODB++ files, fabrication drawings, and assembly documentation.
Experience supporting prototype builds and resolving PCB layout issues during system bring-up.
Experience with semiconductor equipment, industrial automation, or other high-reliability electronic systems preferred.
Responsibilities:
Create and optimize PCB layouts for complex multilayer printed circuit boards, including routing, stackups, controlled impedance requirements, and manufacturing release preparation.
Apply signal integrity, power integrity, EMI, and EMC design practices to ensure performance, reliability, and stable power delivery.
Collaborate with electrical, mechanical, firmware, test, and manufacturing teams to translate system requirements into manufacturable PCB designs.
Generate complete production release packages, maintain PCB libraries, and ensure footprint accuracy and design consistency.
Support prototype builds, resolve layout-related issues, incorporate DFM and DFA requirements, and work with manufacturing vendors to address stackup and fabrication requirements.
