JOB DESCRIPTION
Job Title: Process Technician
FLSA Status:Non-Exempt
Job Code: 22103
Date Created: 9/25/2026
Reports To: Engineering Manager
Department Name: 200 - Engineering
Location: Silicon Valley
POSITION SUMMARY
The Process Technician supports dielevel semiconductor production including wafer expansion, automated die sorting, waffle pack loading, Tape & Reel packaging, and AOI inspection. This role ensures equipment readiness, stable process performance, and accurate execution of production lots according to established procedures and quality standards. It requires handson experience with industrystandard die sorting platforms and AOI systems, strong production support capability, and consistent adherence to training and certification requirements.
KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE
- Operate and set up die sorting machines and AOI systems according to production travelers and specifications.
- Perform wafer expansion, frame loading, die pickandplace, bin verification, and packaging into waffle packs or Tape & Reel carriers.
- Conduct AOI inspections, classify defects, and disposition parts based on defined criteria.
- Record process data accurately and maintain complete documentation for traceability.
- Support lot prioritization, material flow, and production throughput to meet daily output targets.
- Conduct routine equipment PMs, basic troubleshooting, and minor adjustments to maintain uptime.
- Assist engineering with rootcause investigations, corrective actions, and process improvement activities.
- Verify recipes, parameters, and equipment readiness at the start of each shift.
- Support onboarding and handson training for new operators when assigned.
- Follow cleanroom protocols, gowning procedures, and safety requirements at all times.
- Communicate clearly with shift leads, engineers, and supervisors regarding issues, delays, or material status.
- Report equipment alarms, quality concerns, or process deviations promptly.
- Support engineering experiments, DOE runs, and process qualifications as needed.
JOB REQUIREMENTS INCLUDE
Education: High School Diploma or equivalent required. College degree preferred.
Experience: Three to Fiveyears related experience required.
Must be a U.S. person or Valid Green card holder
Preferred Experience & Qualifications:
- Handson experience operating and maintaining die sorting platforms (Royce MP300, AP+, Mulhabuer Ecoline, Mi30) and AOI inspection systems such as Camtek Eagle AG.
- 3–5 years of experience in semiconductor assembly, die sort, or waferlevel manufacturing.
- Familiarity with waferlevel processes (backgrind, marking, dicing, inspection) is a plus.
- Ability to read and follow technical procedures, travelers, and work instructions.
- Strong attention to detail and commitment to quality.
- Comfortable working in a cleanroom environment and handling fragile materials.
- Basic computer skills for data entry and equipment interfaces.
- Ability to lift up to 25 lbs and stand for extended periods.
EMPLOYEE___________________________________________ Date ____________
