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Reliability Lab Engineer

Compal USA Technology Inc

Hutto, TX 78634 • 10/31/2026

Job Description

Job Description

POSITION SUMMARY

The Reliability Lab Engineer plans, executes, documents, and improves product and process reliability evaluations for SMT assemblies, repaired PCBAs, and assembled server systems. The role validates product robustness, investigates failure mechanisms, supports new product introduction (NPI) and engineering changes, and converts laboratory findings into corrective and preventive actions. Testing includes electrical, environmental, thermal, mechanical, and operational stress evaluations appropriate to product and customer requirements, with particular attention to high-density GPU/server platforms, power delivery, connectors, and liquid-cooling interfaces where applicable.

LEVEL I – Reliability Lab Engineer I

Key Responsibilities

• Execute approved reliability test plans for SMT components, PCBAs, repaired boards, and server assemblies under engineering supervision.

• Prepare samples, fixtures, test setups, labeling, and traceability records; verify test conditions and acceptance criteria before starting.

• Operate environmental chambers, thermal cycling equipment, temperature/humidity loggers, power supplies, electronic loads, DMMs, oscilloscopes, and data acquisition tools as qualified.

• Perform functional checks before, during, and after stress testing; capture failure symptoms, photographs, measurements, and test logs.

• Support thermal profiling, burn-in, power cycling, vibration/shock, and humidity exposure tests when specified by approved methods.

• Follow ESD controls, equipment safety requirements, calibration status checks, and laboratory work instructions.

• Enter test results and deviations in approved laboratory reports and MES/QMS systems; segregate failed samples for analysis.

• Assist with initial failure isolation and collaborate with SMT, Repair, Manufacturing, and Quality teams.

Qualifications

• Bachelor’s degree in Electrical, Electronics, Mechanical, Materials, Reliability Engineering, or related discipline.

• 1–3 years of experience in electronics testing, manufacturing, PCBA repair, or laboratory operations.

• Basic understanding of SMT solder joints, BGA/QFN components, PCBAs, server hardware, ESD protection, and test documentation.

• Ability to interpret drawings, schematics, test procedures, and equipment measurement data.

LEVEL II – Reliability Lab Engineer II

Additional Responsibilities

• Develop and validate reliability test plans, sample sizes, test conditions, and pass/fail criteria with Design, Manufacturing, and Customer Quality teams.

• Lead environmental and operational evaluations such as temperature cycling, thermal shock, damp heat, burn-in, power cycling, and vibration/shock as applicable.

• Analyze SMT/PCBA failure mechanisms including solder fatigue, cracked joints, head-in-pillow, component damage, intermittent connections, and repair-induced defects.

• Investigate server-level failures involving power distribution, thermal management, fans, interconnects, GPU boards, and liquid-cooling leakage or interface integrity when applicable.

• Perform failure analysis using electrical troubleshooting, microscopy, X-ray, cross-sectioning, or external analytical laboratories as appropriate.

• Apply statistical methods, Weibull/life-data analysis where justified, trend charts, and design-of-experiments principles to interpret reliability results.

• Lead structured root cause analysis (5 Why, fishbone, 8D) and verify corrective-action effectiveness following repeat failures or RMA trends.

• Coordinate laboratory equipment calibration, preventive maintenance, method validation, and controlled records for audit readiness.

• Support NPI qualification, process changes, repair-process validation, and customer reliability reporting.

Qualifications

• 3–6 years in electronics reliability, SMT/PCBA manufacturing, server assembly, or repair engineering.

• Hands-on experience with environmental chambers, electrical instrumentation, and structured failure analysis.

• Working knowledge of IPC workmanship and repair standards, ESD controls, and risk-based qualification methods.

• Proficiency in technical reporting, statistical analysis, and cross-functional problem solving.

LEVEL III – Senior Reliability Lab Engineer III

Additional Responsibilities

• Own the reliability laboratory roadmap, qualification strategy, test capability, capacity planning, and technical standards for SMT, PCBA repair, and server platforms.

• Define risk-based reliability qualification matrices for high-density GPU boards, high-power systems, BGA assemblies, connectors, and liquid-cooled server configurations.

• Lead accelerated stress and life testing strategies, reliability modeling, and failure-mechanism-driven test selection; document assumptions and limitations.

• Approve test methods, engineering protocols, acceptance criteria, and technical reports in alignment with customer and product requirements.

• Direct complex multi-disciplinary investigations of field returns, recurring RMA issues, and latent failures; integrate findings into design and process improvements.

• Partner with R&D, Supplier Quality, Manufacturing Engineering, and Repair to establish reliability design rules, screening strategies, and corrective actions.

• Develop laboratory investment plans for chambers, thermal measurement, power cycling, vibration, inspection, and data systems; qualify external labs as needed.

• Lead customer technical reviews and audits; maintain traceability, data integrity, and compliance with applicable QMS and ESD requirements.

• Mentor junior engineers and technicians, establish technical training, and drive reliability KPIs such as test completion, failure recurrence, and closure effectiveness.

Qualifications

• 6–10+ years of high-reliability electronics engineering, including significant hands-on laboratory and failure analysis experience.

• Demonstrated leadership in server, GPU, SMT/PCBA, or repair reliability qualification programs.

• Advanced understanding of thermal, electrical, mechanical, material, and solder-interconnect failure mechanisms.

• Experience with reliability statistics, accelerated testing, customer qualification, and technical team development.

COMMON PERFORMANCE EXPECTATIONS

• Safe, repeatable testing with complete sample traceability and calibrated equipment.

• On-time, technically sound reports with clear conclusions, risks, and recommended actions.

• Timely escalation of critical failures and documented closure of corrective actions.

• Continuous improvement of laboratory methods, coverage, and cross-functional learning.