Description The Electronic Warfare (EW) Division is a 430-employee research and development organization in the Leidos Innovations Center (LInC). The EW Division is at the forefront of researching, designing, and developing EW systems, directed energy systems, high speed/hypersonic weapon systems, communications/networking systems, and related technologies for our nation’s defense.The EW Division has an opening for a Chief Electrical Engineer to work with a talented multi-disciplined design team across the division (electrical engineers, systems engineers, software/firmware engineers, scientists, etc.). The Chief Electrical Engineer will direct the design and development of innovative RF hardware systems. Candidate must have a strong background in RF hardware design, test and measurement in support of a fast-paced programs. Primary ResponsibilitiesProvides technical advice/input that impact strategic client outputs and Leidos business results.Impacts functional strategy by developing new solutions, processes, standards or operational plans that position Leidos competitively in the marketplace.Mentors and coaches other technical staff.Serve as Principal Investigator on complex multi-disciplinary programs that typically include field demonstration of real-time hardware systems.Serve as Technical Lead on complex multi-disciplinary proposals.Work on problems of diverse scope, determining methods and procedures to be used on new assignments, and providing feedback and recommendations to other technical personnel.Interact with outside customers, suppliers, and functional peer groups.Some travel and work at remote sites for limited time periods may be occasionally required.Provide status reports to project managers and/or division production manager as required.Basic QualificationsMust be U.S. Citizen.Masters with 15+ years prior relevant experience or Doctorate with 13+ years prior relevant experience.Active Secret clearance with ability to receive TS//SCI.Demonstrated leadership of complex multi-disciplinary technical teams and/or projects.Demonstrated strong oral and written communication.Experience working in Electronic Warfare applications and systems, SIGINT and/or radar fields as a subject matter expert.Demonstrated RF electronic warfare design experience and ability to apply theoretical knowledge in resolving real world problems..Preferred QualificationsDoctoral degree in Electrical Engineering or related.Idea creation and program capture experience (proposals, white papers, etc.).Experience working in a fast-paced Research and Development (R&D) environment.Active TS or TS//SCI clearance.LInCElectronic WarfareOriginal Posting Date:2024-07-09While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.Pay Range:Pay Range $144,300.00 - $260,850.00The Leidos pay range for this job level is a general guideline onlyand not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.

Description The EW Division of Leidos is looking for a Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital Signal Processing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will also support integration, test, and verification in the final products.Primary Responsibilities:The successful candidate will support technical and programmatic assessments of technologies, capabilities, materials, equipment, and performers in support of the advancement of the U.S. Defense Industrial Base’s (DIB) access to trusted, state-of-the-art microelectronics.This position will interface and collaborate with a range of engineers, scientists, policy makers, and executives within the government, industry and academia across the country..Provide occasional technical support and/or field support planning, and other field support in general if needed.Conduct experimental tests on latest SoC evaluation boards, evaluate results, and then develop specifications for selecting next-generation components for deliverable systems.Interact with outside customers, suppliers, and functional peer groups.Some travel and work at remote sites for limited time periods may be occasionally required.Provide status reports to project managers and/or division production manager as required.Basic Qualifications:U.S. Citizenship with the ability to obtain a TS clearance.BS and 8 years required. Masters Degree in Electrical Engineering, Computer Engineering, Computer Science or related technical discipline desired with 6+ years of experienceExperience with DSP fundamentals and FPGA implementationExperience with Matlab/SimulinkExperience with microchip EDA tools and flows (Synopsys, Cadence, etc.)Microelectronics hardware subject matter expertise in at least (1) of the areas listed below AND experience in (1) additional area listed below:Microelectronics Supply Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction)Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.)Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability)Hardware Programming: FPGA (i.e. Verilog, VHDL), Programming (Linux command line/scripting, Python, Java, and C++)Preferred Qualifications:8+ years experience in leading a design teamExperience in hardware test and measurement and hands-on lab debugExperience with interfaces: ADC/DACs, SerDes, PCIe, JTAG, DDRxLInCElectronic WarfareOriginal Posting Date:2024-04-29While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.Pay Range:Pay Range $101,400.00 - $183,300.00The Leidos pay range for this job level is a general guideline onlyand not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.

Description The EW Division of Leidos is looking for a FPGA DSP Firmware Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate challenging DSP FPGA designs and RF sensor systems based on given project requirements. Candidate will have a strong background in Digital Signal Processing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will also support integration, test, and verification in the final products.Primary ResponsibilitiesAnalyze, design, simulate, and implement algorithms in hardware descriptor languages, HDL (VHDL, Verilog), based on customer requirements and/or MATLAB model(s).Collaborate with a multi-disciplined design team (electrical engineers, systems engineers and scientists) to design and integrate challenging DSP FPGA designs and RF sensor systems.Collaborate with a multi-disciplined design team to design and integrate DSP applications for latest System on a Chip (SoC) implementations such as Xilinx Zynq Ultrascale+, Intel Stratix-10, and Xilinx RFSoC.Analyze, design, and implement HDL test benches in hardware description languages, HDL (VHDL, Verilog), for code validation and validation against models.Perform design constraints generation and verification as well as evaluate synthesis and timing performance reports.Implement and validate signal processing concepts such as FFTs, channelizers, digital filters, digital modulation, digital down/up-conversion, adaptive processing, etc. into either new or existing modular HDL designs.Analyze, design, simulate, and implement designs which interface to common signaling standards, typical IP hard macros such as SERDES, PLLS, etc. and/or protocols such PCIe, JESD204B, LVDS, etc.Analyze schematic diagrams for either custom or commercial-off-the shelf (COTS) electronic hardware involving high-speed digital and/or analog circuitry in associated FPGA-centric systems.Develop and maintain requirements documents, functional specification documents, interface control documents, etc.Generate and maintain engineering drawings and configuration management policies for FPGA project hierarchy.Develop project test plans and test procedures, provide test planning support, and assist in the execution of both lab testing and field testing.Provide occasional technical support and/or field support planning, and other field support in general if needed.Conduct experimental tests on latest FPGA and SoC evaluation boards, evaluate results, and then develop specifications for selecting next-generation components for deliverable systems.Work on problems of diverse scope, determining methods and procedures to be used on new assignments, and providing feedback and recommendations to other technical personnel.Interact with outside customers, suppliers, and functional peer groups.Some travel and work at remote sites for limited time periods may be occasionally required.Provide status reports to project managers and/or division production manager as required.Basic QualificationsMust have a current Secret clearance with the ability to obtain a TS/SCI level clearance.Experience with at least one FPGA Integrated Design Environment tool set such as Xilinx Vivado and Mentor Graphics ModelSim.Experience in signal processing theory and communications systems and the ability to apply theoretical knowledge in resolving real world problemsExperience with MATLAB signal processing environmentBS in Electrical Engineering or Computer Engineering or related degreeMinimum of 4 years of relevant experiencePreferred QualificationsMS in Electrical Engineering or Computer Engineering or relatedExperience writing test software in C/C++ or assembly language to validate design5 to 8 years of relevant experienceExperience with hardware integration, test and debug tools (high-speed logic analyzers, scopes, spectrum analyzers, etc.)Familiarity with Electronic Warfare applicationsExperience with high-speed (> GHz) design techniquesARM or RISC-V embedded processor based SoC design experienceExperience with performance characteristics of analog data converters, ADCs/DACs.Familiarity with JESD204BExisting Top Secret ClearanceLInCElectronic WarfareOriginal Posting Date:2024-02-08While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.Pay Range:Pay Range $81,250.00 - $146,875.00The Leidos pay range for this job level is a general guideline onlyand not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.

Description Leidos is seeking a Senior HF Radar Engineer / SME with excellent in-depth design, integration, and implementation technical expertise. The Senior OTHR Engineer is a key position for a program that encompasses full life-cycle development and implementation resulting in the delivery of a High Frequency (HF) OTH radar system.Primary Responsibilities•Lead and support the OTH Radar (OTHR) Program design, modeling / simulation, development, integration and testing of an OTHR integrated system.•Working knowledge of OTHR including fundamentals of HF propagation and analysis•In depth / working knowledge of current OTHR operations – including use for various missions, system capabilities, and limitations•Working knowledge of Command and Control and Monitoring systems supporting OTHR mission operations and support•Demonstrated leader to manage complex projects•Technical management of the RF engineering team and provide technical planning and direction to the assigned engineering team.•Deep understanding of modeling and simulation techniques, for both mission / operational analysis as well as high fidelity modeling of electromagnetic sensor systems•Apply extensive RF and Radar engineering expertise, and knowledge based on experience with OTHR systems design, development, integration, testing, and operations of end-to-end working radar systems.•Conduct engineering trade studies, tests, and demonstrations to verify component, subsystem, and system capabilities prior to full-scale procurement•Conduct component level, subsystem level, and system level integration and test of hardware and software components / subsystems / systems including transmitters, receivers, antenna arrays, and control and monitoring systems and applications.•Develop test plans, test procedures, and test reports for performance, interoperability, and functional tests and demonstrations.•Plan and conduct on-site installation, tests, and demonstration activities at test labs, test ranges, and installation sites.•Lead and support factory acceptance tests, demonstrations, and customer acceptance tests of fully integrated OTHR systems and subsystems.•Provide technical input and recommendations to support other program activities including system accreditation, ATO activities, logistics, and sustainment support.Basic Qualifications•Master’s degree in electrical engineering, physics, or closely related field, with 15+ years of radar systems work experience. Bachelor's Degree and additional years may be used in lieu of degree.•Experience in radar systems and technologies, signal processing techniques, and radar systems test and evaluation.•Previous experience with OTH Radar systems design, integration, and implementation•Understanding of RF transmit, receive, and signal processing techniques as it applies to OTH Radar Systems•Working knowledge of radar modelling and simulation tools and HF propagation modelling•Excellent written and verbal communication skills.•US Citizen with Active Secret security clearance with ability to obtain TS/SCI.•Some remote work.Preferred Qualifications•TS / SCI Security ClearanceOriginal Posting Date:2024-08-26While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.Pay Range:Pay Range $144,300.00 - $260,850.00The Leidos pay range for this job level is a general guideline onlyand not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.